UMM
EN

CN

language
中国
韩国
韩国
韩国
韩国
韩国
imgboxbg

Products Center

Top ten high-end specialty thin material products

搜索
Search

Products

All categories
Your location:
Homepage
/
/
High-quality optoelectronic materials/high-purity targets
Contains MOCVD heating parts, High-performance sputtering target, High purity metal Evaporation materials, rhenium target, Os sputtering target, Ru sputtering target, Ta sputtering target, Tantalum target, Ir sputtering target, tungsten titanium target, ruthenium target, osmium target, nickel chromium target, Iridium target, sputtering target, Tungsten target, Titanium Target, etc.
编号:
Specification: -200 mesh<br> Purity: 4N-6N<br> Uses: Used to prepare high-purity tungsten targets and high-purity tungsten alloy targets, to prepare cemented carbide tools, powder metallurgy, diamond tools, high-density alloys, contacts, refractory alloys. Tungsten alloys, such as tungsten molybdenum alloy, tungsten rhenium alloy, tungsten copper alloy and high density tungsten alloy, etc.
编号:
Number of views:
1000
Keywords:
编号:
Depending on the purpose of use, there are different requirements for the impurity content of high-purity tungsten targets and tungsten-titanium targets. Generally, the chemical purity is required to be between 99.99% and 99.999%. We can also customize other specifications suitable for the application according to user requirements.
编号:
Number of views:
1000
Keywords:
编号:
Tantalum sheets and tantalum plates can be used to manufacture various inorganic acid preparation equipment, corrosion-resistant fasteners, supporting accessories, heat shields, heaters and heat sinks in high-temperature vacuum furnaces, water tanks, bridges and other steel Structure of the cathodic protection system.
编号:
Number of views:
1000
Keywords:
编号:
Ruthenium target is mainly used in the field of vacuum coating<br> Purity: 99.95%<br> Uses: vacuum coating, experimental or research grade ruthenium targets, electronics, optoelectronics, military, decorative coating, functional films, etc.
编号:
Number of views:
1000
Keywords:
编号:
1. Purity: 99.99%; 99.999%<br> 2、Density:  ≥19.1g/cm3;<br> 3、Flatness:≤2%;  <br>
编号:
Number of views:
1000
Keywords:
编号:
Our company uses solid-liquid mixing to improve the uniformity of rhenium, and at the same time, through multiple forging and annealing to increase the density and improve the structure, improve the performance and life of the anode target. <br>
编号:
Number of views:
1000
Keywords:
Tungsten rhenium sputtering target
Tungsten rhenium X-ray target
Tungsten Rhenium CT Tube Target
编号:
Purity: 4N-5N <br> Dimensions: diameter 50~400mm, thickness 3~28mm<br> Can be customized according to customer requirements
编号:
Number of views:
1000
Keywords:
编号:
Executive standard: ASTM B 365 GB/T26012-2010<br> Grades: Ta1, Ta2 <br> Purity: 99.95% 99.99%
编号:
Number of views:
1000
Keywords:
编号:
A. Titanium wire specifications: φ0.8-φ6.0mm <br> B. Specification of titanium wire for glasses: φ1.0-φ6.0mm dedicated titanium wire <br> C. Titanium wire specifications: φ0.2-φ8.0mm hanger dedicated<br>
编号:
Number of views:
1000
Keywords:
High purity titanium wire
titanium alloy wire
编号:
Ion implantation
Ion implantation is a kind of material surface modification high and new technology that has been vigorously developed and widely used internationally in the past 30 years. It has realized the optimization of the surface performance of the material or can obtain some new excellent performance. Due to the unique and prominent features of this high-tech, it is a very important technology in modern integrated circuit manufacturing. It uses an ion implanter to achieve semiconductor doping and change the conductivity of the semiconductor and the structure of the transistor.
编号:
Ion implantation
Number of views:
1000
Keywords:
编号:
Copper-molybdenum-copper (CMC) packaging material is a sandwich-structured flat composite material. It uses pure molybdenum as the core material, and both sides are covered with pure copper or dispersion strengthened copper.  
编号:
Number of views:
1000
Keywords:
编号:
Molybdenum copper is a composite material of molybdenum and copper. Its performance is similar to that of tungsten copper, and it also has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than that of tungsten copper, so it is more suitable for aerospace and other fields. The product has high purity, uniform structure and excellent performance. Because the Mo-Cu material used does not add any adhesive, the material has high thermal conductivity, and the thermal expansion rate matches the ceramic materials and semiconductor materials in the electronics industry. It saves costs through Mo-Cu stamping and mass production, and machining Good performance. Molybdenum copper material is more resistant to ablation than molybdenum, and has more plasticity and machinability. It can be used as high-temperature parts for rockets and missiles with lower temperatures, and can also replace molybdenum as parts in other weapons. High-power integrated circuits and microwave integrated devices require high electrical and thermal conductivity materials as conductive and heat-dissipating components, while taking into account vacuum performance, heat resistance, and thermal expansion coefficient. The properties of molybdenum copper meet these requirements and are the preferred material in this regard.
编号:
Number of views:
1000
Keywords:
Previous page
1
2
3
4
5