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Tungsten and molybdenum ion implantation parts
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Tungsten and molybdenum ion implantation parts
Ion implantation is a kind of material surface modification high and new technology that has been vigorously developed and widely used internationally in the past 30 years. It has realized the optimization of the surface performance of the material or can obtain some new excellent performance. Due to the unique and prominent features of this high-tech, it is a very important technology in modern integrated circuit manufacturing. It uses an ion implanter to achieve semiconductor doping and change the conductivity of the semiconductor and the structure of the transistor.
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Ion implantation is a kind of material surface modification high and new technology that has been vigorously developed and widely used internationally in the past 30 years. It has realized the optimization of the surface performance of the material or can obtain some new excellent performance. Due to the unique and prominent features of this high-tech, it is a very important technology in modern integrated circuit manufacturing. It uses an ion implanter to achieve semiconductor doping and change the conductivity of the semiconductor and the structure of the transistor.

 

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Application

Since the ion source is converted to plasma ions during ion implantation, the operating temperature will be above 2000 ℃, and the ion beam will also generate a large amount of kinetic energy when the ion beam erupts, and the general metal will quickly melt. Therefore, inert metals with relatively large mass and density are required to maintain the direction of the ion beam and increase component durability. Tungsten material has the advantages of stable high temperature chemical performance, low thermal denaturation and long service life. It has become the first choice for ion source parts and consumables of ion implanters in the semiconductor industry. These are collectively referred to as ion implanted tungsten parts

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欧泰稀材
Diffuse copper
Compared with oxygen-free copper materials, dispersed copper has higher hardness (HV>125) and higher strength (tensile strength>350MPa), while the corresponding data of oxygen-free copper is HV40,250MPa. And has a higher softening temperature.
Copper/molybdenum copper/copper (CPC)
Similar to copper/molybdenum/copper (CMC), copper/molybdenum-copper/copper is also a sandwich structure. It consists of two sub-layers-copper (Cu) and a core layer-molybdenum copper alloy (MoCu), which is in the X area It has a different thermal expansion coefficient from the Y area. Compared with tungsten copper, molybdenum copper and copper/molybdenum/copper materials, copper-molybdenum-copper-copper (Cu/MoCu/Cu) has a higher thermal conductivity and a relatively advantageous price.
Tungsten Copper
1. Tungsten copper electronic packaging materials have adjustable thermal expansion coefficients, which can be matched with different substrates (such as: stainless steel, valve alloy, silicon, gallium arsenide, gallium nitride, aluminum oxide, etc.); <br> 2. No sintering activation elements are added, maintaining good thermal conductivity; <br> 3. Low porosity and good air tightness of the product; <br> 4. Good size control, surface finish and flatness.<br> 5. Provide sheets and molded parts, which can also meet electroplating needs.<br>
Molybdenum copper
Molybdenum copper is a composite material of molybdenum and copper. Its performance is similar to that of tungsten copper, and it also has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than that of tungsten copper, so it is more suitable for aerospace and other fields. The product has high purity, uniform structure and excellent performance. Because the Mo-Cu material used does not add any adhesive, the material has high thermal conductivity, and the thermal expansion rate matches the ceramic materials and semiconductor materials in the electronics industry. It saves costs through Mo-Cu stamping and mass production, and machining Good performance. Molybdenum copper material is more resistant to ablation than molybdenum, and has more plasticity and machinability. It can be used as high-temperature parts for rockets and missiles with lower temperatures, and can also replace molybdenum as parts in other weapons. High-power integrated circuits and microwave integrated devices require high electrical and thermal conductivity materials as conductive and heat-dissipating components, while taking into account vacuum performance, heat resistance, and thermal expansion coefficient. The properties of molybdenum copper meet these requirements and are the preferred material in this regard.
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