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Tungsten Titanium Target
Depending on the purpose of use, there are different requirements for the impurity content of high-purity tungsten targets and tungsten-titanium targets. Generally, the chemical purity is required to be between 99.99% and 99.999%. We can also customize other specifications suitable for the application according to user requirements.
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Product description

Application:

High-purity tungsten targets, high-purity tungsten-titanium alloy targets, and tungsten-silicon composite targets are usually applied by magnetron sputtering to produce various complex and high-performance thin film materials. Because high-purity tungsten or ultra-pure tungsten (5 N or 6 N) has high resistance to electron migration, high temperature stability, and the ability to form stable silicides, it is often used as a thin film in the electronics industry as a gate, connection, transition and Barrier metal. Ultra-high-purity tungsten and its silicides are also used in ultra-large-scale integrated circuits as resistance layers, diffusion barriers, etc., and as gate materials and connection materials in metal oxide semiconductor transistors. Tungsten-titanium alloy sputtering targets are often used to make transition metal layers of thin-film solar cells.

 

Specification:

Name

Molecular formula Specification

Size

Relative density Grain size Defect rate
Tungsten target

W

4N(99.99%)

Inch

mm

≥99%

≯50µm

0

5N(99.999%)

D(6,8,10,12)

H(0.25,0.5,0.75)

Diameter 150~350

Thickness 6~25

Tungsten Titanium Target

WTi10

WTi20

4N(99.99%)

≥99%

≯50µm

0

4N5(99.995%)

 

Chemical Composition

           Specification grade

Chemical index

 W/(W+Ti)≥99.99%

 W/(W+Ti)≥99.995%

 W≥99.999%

Total trace impurities

≯100 ppm

≯50 ppm

≯10 ppm

Impurity index(ppm)

Max

Typical value Max Typical value Max Typical value

Radioactive elements

U

0.2

0.1

0.05

0.0008

0.0005

Th

0.2

0.1

0.05

0.0008

0.0005

Alkali metal elements

Li

1

0.05

0.02

0.01

0.01

0.003

Na

5

1

0.5

0.2

0.1

0.05

K

5

1

0.1

0.05

0.05

0.03

Mo,Re

10

5

10

5

1

0.5

Fe,Cr

10

5

5

3

0.5

0.3

Ca,Si,Cu,Ni,Al,Zn,Sn,Mn,Co,Hg,V

2

1

0.5

0.3

0.2

0.2

P,As,Se

2

1

0.5

0.2

0.2

0.2

B,Pb,Sb,Be,Ba,Bi,Cd,Ge,Nb,Pt,Mg,Zr,Au,In,Ga,Ag

1

0.5

0.5

0.1

0.1

0.1

All other individual elements

1

0.5

0.5

0.1

0.1

0.1

Gas analysis

(≯,ppm)

O

C

N

H

S

30

20

20

20

10

 

Depending on the purpose of use, there are different requirements for the impurity content of high-purity tungsten targets and tungsten-titanium targets. Generally, the chemical purity is required to be between 99.99% and 99.999%. We can also customize other specifications suitable for the application according to user requirements.

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Ruthenium target, Ru sputtering target
Ruthenium target is mainly used in the field of vacuum coating<br> Purity: 99.95%<br> Uses: vacuum coating, experimental or research grade ruthenium targets, electronics, optoelectronics, military, decorative coating, functional films, etc.
High purity titanium target
Purity: 4N-5N <br> Dimensions: diameter 50~400mm, thickness 3~28mm<br> Can be customized according to customer requirements
Rhenium target, rhenium sputtering target
Specifications: Purity Re≥99.99%~99.999%, shape, size and density accept various customized products. <br> Rhenium target material is used for magnetron sputtering coating. Magnetron sputtering coating is a new type of physical vapor (PVD) coating method. Compared with evaporation coating method, it has obvious advantages in many aspects. A more mature technology, magnetron sputtering has been used in many fields, such as semiconductor integrated circuits, solar photovoltaics, recording media, flat-panel displays, and workpiece surface coatings.
Mo-Re Target
product manual The ratio of molybdenum to rhenium: MoRe14%, MoRe41%, MoRe44.5%, MoRe47.5% Size range: thickness (0.2-20) × width (≯500) × length (≯1000), can be customized according to customer requirements Process flow: powder mixing → pressing → sintering → forging → annealing → machining → dynamic balance → vacuum degassing → packaging use A type of alloy formed by adding 14% to 47.5% rhenium to molybdenum. After adding rhenium, the ductility, welding performance and formability of the alloy can be greatly improved. Even after high temperature use, the molybdenum-rhenium alloy can still maintain good ductility Sex. Molybdenum-rhenium alloys are widely used in the electronics industry, nuclear industry and aerospace industry.
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