中文 /  EN

Industry Solutions

UMM Professional to provide suitable solutions for all walks of life



Number of views:

| Semiconductor, microelectronics industry chip heat dissipation (thermal management) materials, nuclear energy, medical equipment and many other applications, electrical and heat conduction solutions

Retail price
Market price
At present and in the future, the miniaturization and multi-functionalization of electronic components put forward higher requirements for the heat dissipation of the devices. High-performance heat dissipation (thermal management) materials need to have the characteristics of low density, high thermal conductivity, and thermal expansion matching with semiconductor chip materials, good hardness, and excellent air tightness. Tungsten-copper and molybdenum-copper are often preferred as heat sink materials due to the above advantages. UMM customizes a series of high-quality tungsten copper, molybdenum copper products for users.
Product serial number
Product description

Solution advantages


Low density
Low porosity, good air tightness
 2  Higher thermal conductivity
No sintering activation elements are added, maintaining good thermal conductivity
 3  Can be punched into parts
Provide sheets, molded parts, can also meet electroplating needs
 4  Different expansion coefficients
Different expansion coefficients can be designed,Match with different substrates


We could not find any corresponding parameters, please add them to the properties table

Product portfolio

Copper/molybdenum copper/copper (CPC)
Copper/molybdenum copper/copper (CPC)
Similar to copper/molybdenum/copper (CMC), copper/molybdenum-copper/copper is also a sandwich structure. It consists of two sub-layers-copper (Cu) and a core layer-molybdenum copper alloy (MoCu), which is in the X area It has a different thermal expansion coefficient from the Y area. Compared with tungsten copper, molybdenum copper and copper/molybdenum/copper materials, copper-molybdenum-copper-copper (Cu/MoCu/Cu) has a higher thermal conductivity and a relatively advantageous price.
Copper-molybdenum-copper (CMC)
Copper-molybdenum-copper (CMC)
Copper-molybdenum-copper (CMC) packaging material is a sandwich-structured flat composite material. It uses pure molybdenum as the core material, and both sides are covered with pure copper or dispersion strengthened copper.  
Molybdenum copper
Molybdenum copper
Molybdenum copper is a composite material of molybdenum and copper. Its performance is similar to that of tungsten copper, and it also has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than that of tungsten copper, so it is more suitable for aerospace and other fields. The product has high purity, uniform structure and excellent performance. Because the Mo-Cu material used does not add any adhesive, the material has high thermal conductivity, and the thermal expansion rate matches the ceramic materials and semiconductor materials in the electronics industry. It saves costs through Mo-Cu stamping and mass production, and machining Good performance. Molybdenum copper material is more resistant to ablation than molybdenum, and has more plasticity and machinability. It can be used as high-temperature parts for rockets and missiles with lower temperatures, and can also replace molybdenum as parts in other weapons. High-power integrated circuits and microwave integrated devices require high electrical and thermal conductivity materials as conductive and heat-dissipating components, while taking into account vacuum performance, heat resistance, and thermal expansion coefficient. The properties of molybdenum copper meet these requirements and are the preferred material in this regard.
Tungsten Copper
Tungsten Copper
1. Tungsten copper electronic packaging materials have adjustable thermal expansion coefficients, which can be matched with different substrates (such as: stainless steel, valve alloy, silicon, gallium arsenide, gallium nitride, aluminum oxide, etc.);
2. No sintering activation elements are added, maintaining good thermal conductivity;
3. Low porosity and good air tightness of the product;
4. Good size control, surface finish and flatness.
5. Provide sheets and molded parts, which can also meet electroplating needs.
Previous page