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Copper/molybdenum copper/copper (CPC)
1铜钼铜铜CPC1
1铜钼铜CMC2
1铜钼铜铜CPC1
1铜钼铜CMC2
Copper/molybdenum copper/copper (CPC)
Similar to copper/molybdenum/copper (CMC), copper/molybdenum-copper/copper is also a sandwich structure. It consists of two sub-layers-copper (Cu) and a core layer-molybdenum copper alloy (MoCu), which is in the X area It has a different thermal expansion coefficient from the Y area. Compared with tungsten copper, molybdenum copper and copper/molybdenum/copper materials, copper-molybdenum-copper-copper (Cu/MoCu/Cu) has a higher thermal conductivity and a relatively advantageous price.
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Product description

Similar to copper/molybdenum/copper (CMC), copper/molybdenum-copper/copper is also a sandwich structure. It consists of two sub-layers-copper (Cu) and a core layer-molybdenum copper alloy (MoCu), which is in the X area It has a different thermal expansion coefficient from the Y area. Compared with tungsten copper, molybdenum copper and copper/molybdenum/copper materials, copper-molybdenum-copper-copper (Cu/MoCu/Cu) has a higher thermal conductivity and a relatively advantageous price.

 

Advantages of copper/molybdenum copper/copper (CPC) electronic packaging materials:

1. Higher thermal conductivity than CMC
2. Can be punched into parts, reducing costs
3. The interface is firmly bonded and can withstand the impact of 850℃ high temperature repeatedly
4. Designable thermal expansion coefficient, matching with materials such as semiconductors and ceramics
5. Non-magnetic

 

Performance:

Brand

Density g/cm3

 Coefficient of thermal expansion×10-6 CTE (20℃) Thermal conductivity W/(M·K)

CPC141

9.5

7.3

211

CPC111

9.2

9.5

260

CPC232

9.3

7.5

250

 

Application:

With designable thermal expansion coefficient and thermal conductivity, copper/molybdenum copper/copper (CPC) is used as substrate and flange for RF, microwave and semiconductor high-power devices.

We could not find any corresponding parameters, please add them to the properties table
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Copper target
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Diffuse copper
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