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| Semiconductor equipment MOCVD thermal field solution

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Metal Organic Chemical Vapor Deposition (MOCVD) is a chip epitaxial technology for preparing mixed semiconductor devices, metal and metal oxide and metal nitride film materials. The heating system is an important part of the MOCVD equipment. Whether it can heat the substrate quickly and uniformly directly affects the quality of film deposition, thickness consistency, and chip performance. The rhenium alloy under UMM has 10 years of professional production technology experience in the production of rhenium heaters for MOCVD and a complete quality control management system. It is a substitute for imported big-name or original parts of rhenium heaters for MOCVD and can carry out OEM full-process foundry. It is the number one domestic manufacturer with the most technical development strength and quality assurance ability.
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1  MCOVD outer
High-density, high-performance rhenium plate precision-rolled rhenium sheet, precision electron beam welding, perfect surface treatment to achieve high emissivity.		  2  MCOVD Middle
High-purity tungsten plate is cut with slow-moving wire to ensure the stable high-temperature performance and finished size of the tungsten ring.		  3  MCOVD inner
Rhenium plate with high density and excellent performance is precision-rolled thin rhenium sheet, the mold is bent, the high temperature heat treatment can effectively prevent the deformation of the rhenium ring during high temperature use.

 

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Product portfolio

欧泰稀材
Rhenium outer
Rhenium outer
High-density, high-performance rhenium plate precision-rolled rhenium sheet, precision electron beam welding, perfect surface treatment to achieve high emissivity.
Processing method: non-standard parts are processed according to customer drawings; standard accessories K465i, K700, A7 are provided; product repair services are provided.
Tungsten middle
Tungsten middle
The high-purity tungsten plate is used for slow wire cutting to ensure the stable high-temperature performance and finished size of the tungsten middle ring.
Thickness range: 1.2-2.4mm or customized according to customer requirements
Tungsten rhenium bracket
Tungsten rhenium bracket
Used for MOCVD hot field heating plate support, diameter 1mm or customized, transferred to mold setting, can ensure high dimensional accuracy.
Rhenium inner
Rhenium inner
Thickness range of rhenium sheet: 0.15-0.3mm or customized according to customer requirements
Processing method: non-standard parts are processed according to customer drawings; standard accessories K465i, K700, A7 are provided; product repair services are provided.
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