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Tungsten Copper
2. No sintering activation elements are added, maintaining good thermal conductivity;
3. Low porosity and good air tightness of the product;
4. Good size control, surface finish and flatness.
5. Provide sheets and molded parts, which can also meet electroplating needs.
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Product description
Tungsten-copper electronic packaging material has both the low expansion characteristics of tungsten and the high thermal conductivity of copper. What is particularly valuable is that its coefficient of thermal expansion and thermal conductivity can be designed by adjusting the composition of the material, thus giving the material its application Brings great convenience.
Our company uses high-purity and high-quality raw materials, after pressing and forming, high-temperature sintering and infiltration, WCu electronic packaging materials and heat sink materials with excellent performance are obtained.
Tungsten Copper (WCu) electronic packaging material advantages:
1. Tungsten copper electronic packaging materials have adjustable thermal expansion coefficients, which can be matched with different substrates (such as: stainless steel, valve alloy, silicon, gallium arsenide, gallium nitride, aluminum oxide, etc.);
2. No sintering activation elements are added, maintaining good thermal conductivity;
3. Low porosity and good air tightness of the product;
4. Good size control, surface finish and flatness.
5. Provide sheets and molded parts, which can also meet electroplating needs.
Performance:
|
Brand |
Tungsten content Wt% |
Density g/cm3 |
Thermal expansion coefficient ×10-6 CTE（20℃） |
Thermal Conductivity W/（M·K） |
|
90WCu |
90±2% |
17.0 |
6.5 |
180 (25℃) /176 (100℃) |
|
85WCu |
85±2% |
16.4 |
7.2 |
190 (25℃)/ 183 (100℃) |
|
80WCu |
80±2% |
15.65 |
8.3 |
200 (25℃) / 197 (100℃) |
|
75WCu |
75±2% |
14.9 |
9.0 |
230 (25℃) / 220 (100℃) |
|
50WCu |
50±2% |
12.2 |
12.5 |
340 (25℃) / 310 (100℃) |
Application:
Materials suitable for packaging with high-power devices, such as substrates, bottom electrodes, etc.; high-performance lead frames; thermal control boards and radiators for military and civilian thermal control devices.
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Molybdenum copper
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Compared with oxygen-free copper materials, dispersed copper has higher hardness (HV>125) and higher strength (tensile strength>350MPa), while the corresponding data of oxygen-free copper is HV40,250MPa. And has a higher softening temperature.
Similar to copper/molybdenum/copper (CMC), copper/molybdenum-copper/copper is also a sandwich structure. It consists of two sub-layers-copper (Cu) and a core layer-molybdenum copper alloy (MoCu), which is in the X area It has a different thermal expansion coefficient from the Y area. Compared with tungsten copper, molybdenum copper and copper/molybdenum/copper materials, copper-molybdenum-copper-copper (Cu/MoCu/Cu) has a higher thermal conductivity and a relatively advantageous price.
Molybdenum copper is a composite material of molybdenum and copper. Its performance is similar to that of tungsten copper, and it also has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than that of tungsten copper, so it is more suitable for aerospace and other fields. The product has high purity, uniform structure and excellent performance. Because the Mo-Cu material used does not add any adhesive, the material has high thermal conductivity, and the thermal expansion rate matches the ceramic materials and semiconductor materials in the electronics industry. It saves costs through Mo-Cu stamping and mass production, and machining Good performance. Molybdenum copper material is more resistant to ablation than molybdenum, and has more plasticity and machinability. It can be used as high-temperature parts for rockets and missiles with lower temperatures, and can also replace molybdenum as parts in other weapons. High-power integrated circuits and microwave integrated devices require high electrical and thermal conductivity materials as conductive and heat-dissipating components, while taking into account vacuum performance, heat resistance, and thermal expansion coefficient. The properties of molybdenum copper meet these requirements and are the preferred material in this regard.
Copper-molybdenum-copper (CMC) packaging material is a sandwich-structured flat composite material. It uses pure molybdenum as the core material, and both sides are covered with pure copper or dispersion strengthened copper.
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