The target material is the core raw material for preparing functional thin films in the fields of semiconductors, display panels, photovoltaics, etc., and the process is irreplaceable. Because it is the target material bombarded by high-speed metal plasma flow during the sputtering process, also known as "sputtering target", its purity is above 99.95%, and different films can be obtained by replacing different targets, which can realize functions such as conduction or blocking. 

The main links in the target manufacturing industry chain are "metal purification - target manufacturing - sputtering coating - terminal application", and the difference in added value of each link also follows the distribution of the smile curve.

Among them, sputtering coating is the most technically demanding link in the entire industrial chain, and the quality of sputtering film has an important impact on the quality of downstream products.
Target manufacturing involves many processes, high technical thresholds, large equipment investment, and relatively few companies with large-scale production capacity.

At present, the global target manufacturing industry, especially the high-purity target market, the main share is concentrated in the hands of overseas giants. After mastering the core production technology, leading companies in the United States and Japan implemented strict confidentiality measures to limit technology leakage, and seized the initiative in the global sputtering target market through expansion and integration, with obvious first-mover advantages.