Tungsten-titanium alloy targets are produced by powder metallurgy technology and are widely used in semiconductors and thin-film solar cells. For semiconductor applications, the WTi 10 wt% films are used as diffusion barriers and adhesion layers to separate metallization layers from semiconductors, eg, aluminum from silicon, or copper from silicon. Thus, the functionality of semiconductors in microchips can be significantly improved. For thin-film solar cells, the WTi 10wt% film also acts as a barrier to prevent the diffusion of iron atoms in the steel substrate to the molybdenum back contact and the CIGS semiconductor. Tungsten-titanium alloy targets are also used in LED and tool coatings.

The main reason for choosing tungsten-titanium alloy target as the diffusion barrier layer and bonding layer for the new semiconductor chip is that the alloy has good surface adhesion and excellent heat dissipation performance. Therefore, the prepared product will have higher comprehensive performance.