Advantages of tungsten titanium alloy
The main reason for choosing tungsten-titanium alloy target as the diffusion barrier layer and bonding layer for the new semiconductor chip is that the alloy has good surface adhesion and excellent heat dissipation performance.
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The main reason for choosing tungsten-titanium alloy target as the diffusion barrier layer and bonding layer for the new semiconductor chip is that the alloy has good surface adhesion and excellent heat dissipation performance.
Application of tungsten titanium target
Tungsten-titanium alloy targets are produced by powder metallurgy technology and are widely used in semiconductors and thin-film solar cells.
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Tungsten-titanium alloy targets are produced by powder metallurgy technology and are widely used in semiconductors and thin-film solar cells.
Application and production method of spherical tungsten powder
Spherical tungsten powder is the main raw material for the production of tungsten alloy, tungsten material and cemented carbide. W powder can be mixed with other metal powders to make tungsten alloy;
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Spherical tungsten powder is the main raw material for the production of tungsten alloy, tungsten material and cemented carbide. W powder can be mixed with other metal powders to make tungsten alloy;
Application of tantalum material
Tantalum is a metal element with an atomic number of 73 and a chemical symbol of Ta. The element corresponding to the element is a steel-gray metal with extremely high corrosion resistance.
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Tantalum is a metal element with an atomic number of 73 and a chemical symbol of Ta. The element corresponding to the element is a steel-gray metal with extremely high corrosion resistance.
Processing technology of high purity tantalum sputtering target material
High purity tantalum sputtering targets are widely used in the electronic information product manufacturing industry. As a sputtering barrier, high purity copper will gradually replace aluminum as the material for metallization wiring on silicon wafers, which can be more widely used.
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High purity tantalum sputtering targets are widely used in the electronic information product manufacturing industry. As a sputtering barrier, high purity copper will gradually replace aluminum as the material for metallization wiring on silicon wafers, which can be more widely used.