The main reason for choosing tungsten-titanium alloy target as the diffusion barrier layer and bonding layer for the new semiconductor chip is that the alloy has good surface adhesion and excellent heat dissipation performance. Therefore, the prepared product will have higher comprehensive performance.

Tungsten-titanium alloy is an alloy material that combines the advantages of transition metal tungsten and titanium. It has the characteristics of higher density and purity, better corrosion resistance, and smaller volume expansion effect, which can effectively reduce the formation of particles during the manufacturing process, that is, high-quality thin films can be successfully prepared.
Advantages of tungsten titanium alloy
1. The production process is simple and the operation is convenient.
2. Using tungsten-titanium powder mixed raw materials, pressing, sintering and arc melting processes, effectively solve the technical problems of low preparation efficiency of traditional tungsten-titanium alloys, material uniformity and impurity content difficult to control.