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Compared with oxygen-free copper materials, dispersed copper has higher hardness (HV>125) and higher strength (tensile strength>350MPa), while the corresponding data of oxygen-free copper is HV40,250MPa. And has a higher softening temperature.
Product Features
Brand |
Melting point |
Softening temperature |
Density g/cm3 |
Thermal expansion coefficient (10-6/K) | Thermal conductivity W/(M.K) |
C15715 |
1083 ℃ |
800 ℃ |
8.84 |
365 |
17.6 |
C1560 |
1083 ℃ |
910 ℃ |
8.81 |
322 |
17.6 |
Comparison of the composition and physical properties of various types of dispersed copper and oxygen-free copper (at room temperature, unless otherwise specified). |
|||||||
UNS Number of alloys |
Alumina content |
Melting point |
Density g/cm3 |
Electrical conductivity |
Thermal conductivity W/(M.K) |
Thermal expansion coefficient |
Elastic modulus |
OFC |
0 % |
1,083℃ |
8.94 |
58 Meg S/m |
391 wat/m/OK |
17.7 μm/m/℃ |
115GPa |
UNS- |
0.3 wt. % |
1,083℃ |
8.90 |
54 Meg S/m |
365 wat/m/OK |
16.6μm/m/℃ |
130GPa |
UNS- |
1.1 wt. % |
1,083℃ |
8.81 |
45Meg S/m |
322 wat/m/OK |
16.6μm/m/℃ |
130GPa |
If you need to reduce the thermal expansion rate, you can add other materials or elements. Adding them at high room temperature and high-intensity heating will increase the hardness.
Adding Glid AL-60 and 10% niobium to the composite material can improve the strength and conductivity of the material. Its hardness is equivalent to most copper-beryllium and copper-tungsten alloys, and its conductivity is comparable to all RWMA2 levels.
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