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High purity tungsten target
2、Density： ≥19.1g/cm3；
3、Flatness：≤2%；
0.0
元
0.0
元
Product description
Application:
High-purity tungsten targets, high-purity tungsten-titanium alloy targets, and tungsten-silicon composite targets are usually applied by magnetron sputtering to produce various complex and high-performance thin film materials. Because high-purity tungsten or ultra-pure tungsten (5 N or 6 N) has high resistance to electron migration, high temperature stability, and the ability to form stable silicides, it is often used as a thin film in the electronics industry as a gate, connection, transition and Barrier metal. Ultra-high-purity tungsten and its silicides are also used in ultra-large-scale integrated circuits as resistance layers, diffusion barriers, etc., and as gate materials and connection materials in metal oxide semiconductor transistors. Tungsten-titanium alloy sputtering targets are often used to make transition metal layers of thin-film solar cells.
Specification:
|
Name |
Molecular formula | Specification |
Size |
Relative density | Grain size | Defect rate | |
| Tungsten target |
W |
4N(99.99%) |
Inch |
mm |
≥99% |
≯50µm |
0 |
|
5N(99.999%) |
D(2,3,4,6,8,10,12) H(0.25,0.5,0.75) |
Diameter 50～350 Thickness 6～25 |
|||||
| Tungsten Titanium Target |
WTi10 WTi20 |
4N(99.99%) |
≥99% |
≯50µm |
0 |
||
|
4N5(99.995%) |
|||||||
Chemical component
|
Specification grade Chemical index |
W/(W+Ti)≥99.99% |
W/(W+Ti)≥99.995% |
W≥99.999% |
|||||||||
| Total trace impurities |
≯100 ppm |
≯50 ppm |
≯10 ppm |
|||||||||
|
Impurity index(ppm) |
Max |
Typical value | Max | Typical value | Max | Typical value | ||||||
|
Radioactive elements |
U |
— |
0.2 |
0.1 |
0.05 |
0.0008 |
0.0005 |
|||||
|
Th |
— |
0.2 |
0.1 |
0.05 |
0.0008 |
0.0005 |
||||||
|
Alkali metal elements |
Li |
1 |
0.05 |
0.02 |
0.01 |
0.01 |
0.003 |
|||||
|
Na |
5 |
1 |
0.5 |
0.2 |
0.1 |
0.05 |
||||||
|
K |
5 |
1 |
0.1 |
0.05 |
0.05 |
0.03 |
||||||
|
Mo，Re |
10 |
5 |
10 |
5 |
1 |
0.5 |
||||||
|
Fe，Cr |
10 |
5 |
5 |
3 |
0.5 |
0.3 |
||||||
|
Ca，Si，Cu，Ni，Al，Zn，Sn，Mn，Co，Hg，V |
2 |
1 |
0.5 |
0.3 |
0.2 |
0.2 |
||||||
|
P，As，Se |
2 |
1 |
0.5 |
0.2 |
0.2 |
0.2 |
||||||
|
B，Pb，Sb，Be，Ba，Bi，Cd，Ge，Nb，Pt，Mg，Zr，Au，In，Ga，Ag |
1 |
0.5 |
0.5 |
0.1 |
0.1 |
0.1 |
||||||
| All other individual elements |
1 |
0.5 |
0.5 |
0.1 |
0.1 |
0.1 |
||||||
|
Gas analysis （≯，ppm） |
O |
C |
N |
H |
S |
|||||||
|
30 |
20 |
20 |
20 |
10 |
||||||||
Depending on the purpose of use, there are different requirements for the impurity content of high-purity tungsten targets and tungsten-titanium targets. Generally, the chemical purity is required to be between 99.99% and 99.999%. We can also customize other specifications suitable for the application according to user requirements.
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Ruthenium target is mainly used in the field of vacuum coating<br>
Purity: 99.95%<br>
Uses: vacuum coating, experimental or research grade ruthenium targets, electronics, optoelectronics, military, decorative coating, functional films, etc.
Tantalum target is usually welded with the copper back target, and then semiconductor or optical sputtering is carried out to deposit tantalum atoms as oxides on the substrate material to achieve sputtering coating.
Chemical purity: 99.95%<br>
Size: Diameter 20～300mm, thickness 1～60mm, customized according to requirements<br>
Application: Osmium target is mainly used in the field of vacuum coating
Niobium is a kind of refractory rare metal with a steel-gray luster. Its melting point is 2467℃ and its density is 8.6g/cm3. Niobium has good low-temperature plasticity and can be cold-pressed into rods, sheets, wires and other products. Niobium can withstand high temperature and high strength, and still has sufficient strength, plasticity and thermal conductivity above 1000°C. Superconductivity is best at extremely low temperatures. For example, its resistance is close to zero at minus 260°C. It is currently the most important superconducting material.
Specifications: Purity Re≥99.99%~99.999%, shape, size and density accept various customized products. <br>
Rhenium target material is used for magnetron sputtering coating. Magnetron sputtering coating is a new type of physical vapor (PVD) coating method. Compared with evaporation coating method, it has obvious advantages in many aspects. A more mature technology, magnetron sputtering has been used in many fields, such as semiconductor integrated circuits, solar photovoltaics, recording media, flat-panel displays, and workpiece surface coatings.
Purity: 4N-5N
<br>
Dimensions: diameter 50～400mm, thickness 3～28mm<br>
Can be customized according to customer requirements
product manual
The ratio of molybdenum to rhenium: MoRe14%, MoRe41%, MoRe44.5%, MoRe47.5%
Size range: thickness (0.2-20) × width (≯500) × length (≯1000), can be customized according to customer requirements
Process flow: powder mixing → pressing → sintering → forging → annealing → machining → dynamic balance → vacuum degassing → packaging
use
A type of alloy formed by adding 14% to 47.5% rhenium to molybdenum. After adding rhenium, the ductility, welding performance and formability of the alloy can be greatly improved. Even after high temperature use, the molybdenum-rhenium alloy can still maintain good ductility Sex. Molybdenum-rhenium alloys are widely used in the electronics industry, nuclear industry and aerospace industry.
Purity: 3N5<br>
Size: 1-10 inches, unconventional size can be customized<br>
Application
The high temperature oxidation resistance and thermoelectric properties of iridium make the iridium/iridium rhodium thermocouple the only precious metal temperature measurement material that can measure high temperatures up to 2100℃ in the atmosphere.
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