UMM
EN

CN

中文 /  EN
language
中国
韩国
韩国
韩国
韩国
韩国
imgboxbg
imgboxbg

Products Center

Top ten high-end specialty thin material products

搜索
Search

Products

All categories
编号:
Copper-molybdenum-copper (CMC) packaging material is a sandwich-structured flat composite material. It uses pure molybdenum as the core material, and both sides are covered with pure copper or dispersion strengthened copper.  
编号:
Number of views:
1000
Keywords:
编号:
Molybdenum copper is a composite material of molybdenum and copper. Its performance is similar to that of tungsten copper, and it also has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than that of tungsten copper, so it is more suitable for aerospace and other fields. The product has high purity, uniform structure and excellent performance. Because the Mo-Cu material used does not add any adhesive, the material has high thermal conductivity, and the thermal expansion rate matches the ceramic materials and semiconductor materials in the electronics industry. It saves costs through Mo-Cu stamping and mass production, and machining Good performance. Molybdenum copper material is more resistant to ablation than molybdenum, and has more plasticity and machinability. It can be used as high-temperature parts for rockets and missiles with lower temperatures, and can also replace molybdenum as parts in other weapons. High-power integrated circuits and microwave integrated devices require high electrical and thermal conductivity materials as conductive and heat-dissipating components, while taking into account vacuum performance, heat resistance, and thermal expansion coefficient. The properties of molybdenum copper meet these requirements and are the preferred material in this regard.
编号:
Number of views:
1000
Keywords:
编号:
1. Tungsten copper electronic packaging materials have adjustable thermal expansion coefficients, which can be matched with different substrates (such as: stainless steel, valve alloy, silicon, gallium arsenide, gallium nitride, aluminum oxide, etc.); <br> 2. No sintering activation elements are added, maintaining good thermal conductivity; <br> 3. Low porosity and good air tightness of the product; <br> 4. Good size control, surface finish and flatness.<br> 5. Provide sheets and molded parts, which can also meet electroplating needs.<br>
编号:
Number of views:
1000
Keywords:
编号:
Similar to copper/molybdenum/copper (CMC), copper/molybdenum-copper/copper is also a sandwich structure. It consists of two sub-layers-copper (Cu) and a core layer-molybdenum copper alloy (MoCu), which is in the X area It has a different thermal expansion coefficient from the Y area. Compared with tungsten copper, molybdenum copper and copper/molybdenum/copper materials, copper-molybdenum-copper-copper (Cu/MoCu/Cu) has a higher thermal conductivity and a relatively advantageous price.
编号:
Number of views:
1000
Keywords:
编号:
Compared with oxygen-free copper materials, dispersed copper has higher hardness (HV>125) and higher strength (tensile strength>350MPa), while the corresponding data of oxygen-free copper is HV40,250MPa. And has a higher softening temperature.
编号:
Number of views:
1000
Keywords:
Previous page
1