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What is a sputtering target used for

What is a sputtering target used for

(Summary description)With the continuous research and development of high-tech products in the market, targets appear frequently on the market. Sputtering targets are one of them.

What is a sputtering target used for

(Summary description)With the continuous research and development of high-tech products in the market, targets appear frequently on the market. Sputtering targets are one of them.

Information

With the continuous research and development of high-tech products in the market, targets appear frequently on the market. Sputtering targets are one of them. They have excellent performance and are very popular in the market. However, there are still many people who do not know about sputtering targets. What is the material used for? Today, Ir sputtering target manufacturers will introduce the use and working principle of sputtering target materials to you!

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Use of sputtering targets

1. Microelectronics

In various application industries, the semiconductor industry has very strict quality requirements for target sputtering films. For example, the requirements of silicon wafer manufacturers are high purity, large size, fine grain and low segregation, so this requires the target to be have a better microstructure.
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2. Display

In recent years, flat-panel displays have greatly impacted computer monitors and TVs mainly based on cathode ray tubes, so it has also driven the technology and market demand for targets. At present, the thin films of flat panel displays are mostly formed by sputtering. The sputtering targets mainly include In2O3, SnO2, MgO, W, Mo, Ni, Cu, Cr, etc.

How sputtering targets work

The sputtering target is mainly composed of target blank, back plate and other parts. The target blank belongs to the target material bombarded by high-speed ion beams and is the core part. In the process of sputtering coating, after the target blank is hit by ions, the surface atoms are The sputtering is scattered and deposited on the substrate to form an electronic thin film. Due to the low strength of high-purity metal, the sputtering target needs to be installed in a special machine to complete the sputtering process. The inside of the machine is a high-voltage and high-vacuum environment, so the sputtering target blank of ultra-high-purity metal needs to be matched with the back. The plates are joined by different welding processes, and the back plate mainly plays the role of fixing the sputtering target, as well as good electrical and thermal conductivity.
 

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