When the circuit diagram is engraved on the wafer, various cleanings are done, ions are implanted, and the switching characteristics are obtained, but the electronic components on the chip must be connected, as if you have placed all the components, and then you connect them to each other with wires, which requires sputtering.

The construction is mainly to prepare thin film materials, which is a kind of physical vapor deposition (PVD) technology. The general meaning of sputtering is to bombard the target with ions, and then the atoms on the target are blasted out, and finally fall on the substrate of single crystal silicon, and then form a metal layer with a specific function, thereby forming a conductive layer or a barrier layer, etc., This is metallization.

After the metal layer is formed on the surface of the chip, photolithography or etching is used to remove the unnecessary parts, so the metal thin lines are left on the surface of the chip, which can connect various components on the chip. High-purity sputtering targets mainly refer to metal or non-metallic targets with a purity of 99.9% to 99.9999%. High-purity sputtering targets include aluminum targets, titanium targets, tantalum targets, and tungsten-titanium targets. Among them, aluminum targets and titanium targets are mainly used in the production of 8-inch wafers, and tantalum and copper targets are mainly used for 12-inch wafers.