Of all the applications for sputtering targets, semiconductors have the highest technical requirements and purity requirements, significantly higher than other applications such as flat panel displays and solar cells. Of course, the price of its target is also the most expensive.

Semiconductor chipsets have extremely strict standards for the purity of the metal material and the internal microstructure of the sputtering target. If the impurity content of the sputtering target is too high, the formed film cannot achieve the desired electrical properties. Moreover, during the sputtering process, it is highly likely that fine particles will form on the wafer, causing short circuits or damage to the circuit, seriously affecting the performance of the film.

Chip manufacturing requires the highest purity of sputtering target metal, usually up to 99.9995%, while flat panel displays and solar cells only need 99.999% and 99.995%, respectively. In addition to purity, the chip also has extremely strict requirements on the internal microstructure of the sputtering target. To produce products that meet the process requirements, it is necessary to master the key technologies in the production process and practice them for a long time.