UMM
EN

CN

中文 /  EN
language
中国
韩国
韩国
韩国
韩国
韩国
imgboxbg
imgboxbg

Application Technology

Understand cutting-edge application technology

搜索
Search

Application Technology

Your location:
Homepage
/
/
Overview of Evaporative Coating and Its Material Selection

Overview of Evaporative Coating and Its Material Selection

(Summary description)Vacuum evaporation coating refers to a technique of obtaining thin films by heating and evaporating a certain substance under vacuum conditions to deposit it on the surface of the substrate material. The substance that has been evaporated is called a evaporative material. Evaporative coating was first proposed by M. Faraday in 1857 and has become one of the mainstream coating technologies after over a hundred years of development.

Overview of Evaporative Coating and Its Material Selection

(Summary description)Vacuum evaporation coating refers to a technique of obtaining thin films by heating and evaporating a certain substance under vacuum conditions to deposit it on the surface of the substrate material. The substance that has been evaporated is called a evaporative material. Evaporative coating was first proposed by M. Faraday in 1857 and has become one of the mainstream coating technologies after over a hundred years of development.

Information

1.Introduction to Evaporative Coating

 

Vacuum evaporation coating refers to a technique of obtaining thin films by heating and evaporating a certain substance under vacuum conditions to deposit it on the surface of the substrate material. The substance that has been evaporated is called a evaporative material. Evaporative coating was first proposed by M. Faraday in 1857 and has become one of the mainstream coating technologies after over a hundred years of development.

 

Evaporative coating is a kind of PVD vacuum deposition, which is characterized by that under vacuum conditions, the material evaporates and condenses on the glass surface to form a film, and then after high temperature heat treatment, a film with strong adhesion is formed on the glass surface. Sputtering coating and evaporation coating are currently the two most mainstream PVD coating methods. The sputtering coating process has good repeatability and controllable film thickness, which can obtain a uniform thickness of thin film on a large area of substrate material. The prepared thin film has advantages such as high purity, good density, and strong adhesion with the substrate material, and has become one of the main technologies for preparing thin film materials. The vacuum evaporation coating technology has the characteristics of simple and convenient operation, fast film forming speed, etc., and is mainly applied to the coating of optical components, LEDs, flat panel displays, and semiconductor separators. From a manufacturing perspective, the manufacturing complexity of evaporated materials is much lower than that of sputtering targets, and evaporated coatings are commonly used for coating small-sized substrate materials. In addition, the selection range of evaporation coating materials is also quite large, with more than 70 elements, more than 50 inorganic compound and a variety of alloy materials available.

 

2.Principle of evaporation coating

 

The vacuum evaporation coating system generally consists of three parts: a vacuum chamber, an evaporation source or evaporation heating device, a substrate placement device and a substrate heating device. In order to evaporate the material to be deposited in vacuum, a container is needed to support or contain the evaporated material, and at the same time, it is necessary to provide evaporation heat to reach a sufficiently high temperature to generate the required vapor pressure. The physical process of evaporation includes: evaporation or sublimation of the deposited material into gaseous particles, rapid transport of gaseous particles from the evaporation source to the substrate surface, attachment of gaseous particles to the substrate surface for nucleation and growth into a solid film, reconstruction or chemical bond of film atoms.

 

Place the substrate in a vacuum chamber and heat the film material using methods such as resistance, electron beam, laser, etc. to evaporate or sublimate the film material, and vaporize it into particles (atoms, molecules, or atomic clusters) with a certain energy (0.1-0.3eV). Gaseous particles are transported rapidly to the substrate in a linear motion with basically no collision. Some particles arriving at the surface of the substrate are reflected, while the other part is absorbed on the substrate and diffused on the surface. Two dimensional collisions occur between the deposited atoms, forming clusters, and some may evaporate after a short pause on the surface. Particle clusters continuously collide with diffusing particles, adsorb single particles, or release single particles. This process is repeated, and when the number of aggregated particles exceeds a certain critical value, it becomes a stable nucleus, and then continues to adsorb and diffuse particles, gradually growing up. Finally, through the contact and merging of adjacent stable nuclei, a continuous thin film is formed.

 

 

Schematic diagram of evaporation coating

 

 

3.Common evaporation materials and selection of evaporation equipment

 

Types of evaporation materials: according to chemical composition, they can be mainly divided into metal/non-metal particle evaporation materials, oxide evaporation materials, fluoride evaporation materials, etc.

 

Metal and non-metallic particles: aluminum steaming material, nickel steaming material, copper steaming material, silver steaming material, titanium steaming material, silicon steaming material, vanadium steaming material, magnesium steaming material, tin steaming material, chromium steaming material, indium steaming material, silver copper steaming material, gold steaming material, microcrystalline silver powder, etc.

 

Oxides: titanium tantalum alloy, zirconium titanium alloy, silicon aluminum alloy, aluminum trioxide, zirconia, titanium pentoxide, quartz ring, erbium oxide, lanthanum titanate, etc.

 

Fluoride: magnesium fluoride, dysprosium fluoride, lanthanum fluoride, etc.

Evaporation Materials Evaporation Mode Evaporation Source Material
1.Metal and non-metallic particles:
aluminum steaming material, nickel steaming material, copper steaming material, silver steaming material, titanium steaming material, silicon steaming material, vanadium steaming material, magnesium steaming material, tin steaming material, chromium steaming material, indium steaming material, silver copper steaming material, gold steaming material, microcrystalline silver powder, etc.

2.Oxides:
titanium tantalum alloy, zirconium titanium alloy, silicon aluminum alloy, aluminum trioxide, zirconia, titanium pentoxide, quartz ring, erbium oxide, lanthanum titanate, etc.

3.Fluoride:
magnesium fluoride, dysprosium fluoride, lanthanum fluoride, etc.
Resistance evaporation:

Materials with an evaporation temperature of 1000-2000°C can be heated by resistance as the evaporation source. After the heater resistance is energized, heat is generated to make the molecules or atoms of the evaporating materials obtain enough kinetic energy to evaporate.
Selection of evaporation source materials:

1. High melting point materials (melting point of evaporation source material>evaporation temperature)

2. Reduce pollution from evaporation sources (evaporation temperature of thin film materials<corresponding temperature of evaporation source materials at vapor pressure of 10-8 Torr);
 
3. The evaporation source material does not react with the thin film material;
 
4. The wettability of the thin film material to the evaporation source;
 
5. Commonly used evaporation source materials include: iridium crucible, tungsten crucible, molybdenum crucible, tantalum crucible, high-temperature resistant metal oxide, ceramic or graphite crucible
Molybdenum particles, tantalum particles, niobium particles, silicon (Si), magnesium fluoride (MgF2), titanium dioxide (TiO2), gallium tritelluride (Ga2Te3), aluminum oxide (Al2O3), tin oxide (SnO2), etc Electron beam evaporation:

The evaporation of refractory materials, achieving rapid evaporation at a higher power density to prevent alloy fractionation; Simultaneously placing multiple crucibles and evaporating multiple different substances simultaneously or separately; Most electron beam evaporation systems use magnetic focusing or magnetic bending electron beams, and the evaporated material is placed in a water-cooled crucible. Evaporation occurs on the surface of the material, effectively suppressing the reaction between the crucible and the evaporated material. It is suitable for preparing high-purity thin films and can be used to prepare thin film materials in the fields of optics, electronics, and optoelectronics. The kinetic energy of the evaporated molecules is large, and a stronger and denser film layer can be obtained than resistance heating.
The structure of electron beam evaporation source can be divided into three types: straight gun (Bulls gun), ring gun (electric deflection) and e-gun (magnetic deflection). Multiple collapses can be placed within an evaporation device, allowing for simultaneous or separate evaporation and deposition of various substances.

 

 

 

High purity and high quality evaporation material particles

Keyword:

Scan the QR code to read on your phone

Hot Technology Ranking

Application of Gold in High-end Manufacturing-Electronic Semiconductor
Application of Gold in High-end Manufacturing-Electronic Semiconductor
Gold has been considered a valuable precious metal since ancient times, and its unique chemical and physical properties have led to its extensive use in various fields. It serves as both a special reserve and investment currency, dominates the jewelry industry, and plays a crucial role in modern industries such as telecommunications, aerospace, and aviation. In the field of electronic device manufacturing, gold is highly regarded for its excellent conductivity. Gold's conductivity is not only superior to common conductive metals like copper and silver but also exhibits excellent stability in extreme environments such as high temperatures, high pressures, and low temperatures. Therefore, gold finds wide applications in semiconductors and electronic components.
See more information
Gold has been considered a valuable precious metal since ancient times, and its unique chemical and physical properties have led to its extensive use in various fields. It serves as both a special reserve and investment currency, dominates the jewelry industry, and plays a crucial role in modern industries such as telecommunications, aerospace, and aviation. In the field of electronic device manufacturing, gold is highly regarded for its excellent conductivity. Gold's conductivity is not only superior to common conductive metals like copper and silver but also exhibits excellent stability in extreme environments such as high temperatures, high pressures, and low temperatures. Therefore, gold finds wide applications in semiconductors and electronic components.
Overview of Vacuum Ion Coating
Overview of Vacuum Ion Coating
With the rapid development of science and technology, the mechanical manufacturing industry plays an increasingly important role in production. Corrosion on the surfaces of mechanical components is a major issue in the industry. Therefore, improving surface hardness, wear resistance, corrosion resistance, and other properties of the components is crucial in the field of mechanical manufacturing. Coating the surface of components is one of the most commonly used methods to enhance their performance. However, coating technologies have several drawbacks. For example, the adhesion of coatings is poor, leading to easy delamination. There is also a significant difference in thermal expansion coefficients between the coating and the substrate material, making the coating prone to cracking. These limitations restrict their practical application in production.
See more information
With the rapid development of science and technology, the mechanical manufacturing industry plays an increasingly important role in production. Corrosion on the surfaces of mechanical components is a major issue in the industry. Therefore, improving surface hardness, wear resistance, corrosion resistance, and other properties of the components is crucial in the field of mechanical manufacturing. Coating the surface of components is one of the most commonly used methods to enhance their performance. However, coating technologies have several drawbacks. For example, the adhesion of coatings is poor, leading to easy delamination. There is also a significant difference in thermal expansion coefficients between the coating and the substrate material, making the coating prone to cracking. These limitations restrict their practical application in production.
Overview of Chemical Vapor Deposition (CVD) Coating
Overview of Chemical Vapor Deposition (CVD) Coating
With the continuous improvement in the requirements of aerospace, nuclear industry, semiconductors, and other fields for semiconductor devices, integrated circuits, high-field and small-sized superconducting materials, and crystal growth products, chemical vapor deposition technology has a broad market application prospect as an essential method for material preparation and effective surface modification. Some researchers predict that CVD will focus on reducing harmful by-products and increasing industrial-scale production in the future. Additionally, the development of lower-temperature CVD processes, more precise control over CVD processes, thick film deposition techniques, novel film materials, and new material synthesis technologies will be the major areas of research in the future.
See more information
With the continuous improvement in the requirements of aerospace, nuclear industry, semiconductors, and other fields for semiconductor devices, integrated circuits, high-field and small-sized superconducting materials, and crystal growth products, chemical vapor deposition technology has a broad market application prospect as an essential method for material preparation and effective surface modification. Some researchers predict that CVD will focus on reducing harmful by-products and increasing industrial-scale production in the future. Additionally, the development of lower-temperature CVD processes, more precise control over CVD processes, thick film deposition techniques, novel film materials, and new material synthesis technologies will be the major areas of research in the future.
Overview of Evaporative Coating and Its Material Selection
Overview of Evaporative Coating and Its Material Selection
Vacuum evaporation coating refers to a technique of obtaining thin films by heating and evaporating a certain substance under vacuum conditions to deposit it on the surface of the substrate material. The substance that has been evaporated is called a evaporative material. Evaporative coating was first proposed by M. Faraday in 1857 and has become one of the mainstream coating technologies after over a hundred years of development.
See more information
Vacuum evaporation coating refers to a technique of obtaining thin films by heating and evaporating a certain substance under vacuum conditions to deposit it on the surface of the substrate material. The substance that has been evaporated is called a evaporative material. Evaporative coating was first proposed by M. Faraday in 1857 and has become one of the mainstream coating technologies after over a hundred years of development.
What are the characteristics of high-quality sputtering targets?
What are the characteristics of high-quality sputtering targets?
PVD (Physical Vapor Deposition) technology is one of the main technologies for preparing thin film materials. Under vacuum conditions, physical methods are used to vaporize a material into gaseous atoms, molecules, or partially ionize it into ions, and through a low-pressure gas (or plasma) process, thin film materials with special functions such as transparency enhancement, reflection, protective conductivity, magnetic conductivity, insulation, corrosion resistance, oxidation resistance, radiation protection, and decoration are deposited on the surface of the substrate material. T
See more information
PVD (Physical Vapor Deposition) technology is one of the main technologies for preparing thin film materials. Under vacuum conditions, physical methods are used to vaporize a material into gaseous atoms, molecules, or partially ionize it into ions, and through a low-pressure gas (or plasma) process, thin film materials with special functions such as transparency enhancement, reflection, protective conductivity, magnetic conductivity, insulation, corrosion resistance, oxidation resistance, radiation protection, and decoration are deposited on the surface of the substrate material. T
Overview of Vacuum Coating Materials And Technologies
Overview of Vacuum Coating Materials And Technologies
Vacuum sputter coating. It refers to the technique of using ions generated by an ion source, which are accelerated and gathered in a vacuum to form a high ion beams, to bombard the surface of the target (coating material), where kinetic energy is exchanged between the ions and the atoms on the surface of the target, causing the atoms on the surface of the target to leave and be deposited on the surface of the substrate material. The object bombarded with ions is the raw material for the deposition of thin film materials by the vacuum sputtering method and is called a sputtering target.
See more information
Vacuum sputter coating. It refers to the technique of using ions generated by an ion source, which are accelerated and gathered in a vacuum to form a high ion beams, to bombard the surface of the target (coating material), where kinetic energy is exchanged between the ions and the atoms on the surface of the target, causing the atoms on the surface of the target to leave and be deposited on the surface of the substrate material. The object bombarded with ions is the raw material for the deposition of thin film materials by the vacuum sputtering method and is called a sputtering target.
Application and preparation method of spherical powder
Application and preparation method of spherical powder
Spherical powders have been widely used in many fields because of their good fluidity and high density. In the field of thermal spraying, the spherical powder makes the coating more uniform and dense because of its good fluidity, so the coating has better wear resistance; In the field of powder metallurgy, the forming parts prepared by spherical powder have high density and uniform shrinkage in the sintering process, so the products obtained have high precision and good performance. It has obvious advantages in the application of advanced powder metallurgy forming technology such as injection molding, gel injection molding and additive manufacturing (such as 3D printing technology).
See more information
Spherical powders have been widely used in many fields because of their good fluidity and high density. In the field of thermal spraying, the spherical powder makes the coating more uniform and dense because of its good fluidity, so the coating has better wear resistance; In the field of powder metallurgy, the forming parts prepared by spherical powder have high density and uniform shrinkage in the sintering process, so the products obtained have high precision and good performance. It has obvious advantages in the application of advanced powder metallurgy forming technology such as injection molding, gel injection molding and additive manufacturing (such as 3D printing technology).
Platinum group metals have been grinding for a decade, and the future is not to be underestimated
Platinum group metals have been grinding for a decade, and the future is not to be underestimated
As the "newborn" of the metal family, platinum group precious metals play an indispensable role from the transformation of the traditional petrochemical industry to the whole industrial chain of new energy, including hydrogen energy, and will eventually play an important role in the development of the 21st century!
See more information
As the "newborn" of the metal family, platinum group precious metals play an indispensable role from the transformation of the traditional petrochemical industry to the whole industrial chain of new energy, including hydrogen energy, and will eventually play an important role in the development of the 21st century!
Advantages and disadvantages of friction stir welding
 Advantages and disadvantages of friction stir welding
The main advantages of friction stir welding are as follows:
See more information
The main advantages of friction stir welding are as follows:
UMM

Scan the QR code and follow the official account