Ru sputtering target factory will introduce to you: the sputtering target industry chain is basically distributed in a pyramid, mainly including four links: metal purification, target manufacturing, sputtering coating and terminal application. Among them, metal purification and target manufacturing are the most important basic links of raw materials in the electronics industry, while sputtering coating is the link with the highest technical requirements in the entire industrial chain, because the quality of sputtered films has an important impact on the quality of downstream products. The terminal application link is the largest field in the entire industrial chain, such as the semiconductor chips, flat panel displays, solar cells and other fields mentioned above.

Upstream metal purification mainly begins with ordinary industrial-grade raw materials. General industrial-grade metals can reach a purity of 99.8%, and sputtering targets need to reach at least 99.95% purity. Semiconductor-grade high-quality materials used for chip manufacturing Sputtering targets even require a purity of 99.99~99.9999% (4N~6N). The target manufacturing process first needs to carry out process design according to the performance requirements of the downstream application field, and then perform repeated plastic deformation and heat treatment to control key indicators such as grains and crystal orientations, and then undergo water cutting, machining, metallization, super-generation testing, Ultrasonic cleaning and other processes.

Ru sputtering target factory will introduce to you: the manufacturing process of sputtering target is delicate and numerous, and the process flow management and manufacturing process level will directly affect the quality and yield of sputtering target. This link is the link with the highest requirements for production equipment and technical processes in the sputtering target industry chain. The quality of sputtered films has an important impact on the quality of downstream film products.