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Related applications of Ru sputtering target Wholesale Price
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- Time of issue:2023-03-09 10:32
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(Summary description)Before understanding Ru sputtering target Wholesale Price, let's first understand the main application fields and technical requirements of sputtering targets.
High-purity sputtering targets are concentrated in the four fields of flat panel display, information storage, solar cells, and chips, accounting for a total of 94%. Among them, the chip field, that is, the semiconductor industry, has the most stringent and demanding requirements for the target material. Copper, aluminum, molybdenum and ITO targets are the most common and widely used targets.
Related applications of Ru sputtering target Wholesale Price
(Summary description)Before understanding Ru sputtering target Wholesale Price, let's first understand the main application fields and technical requirements of sputtering targets.
High-purity sputtering targets are concentrated in the four fields of flat panel display, information storage, solar cells, and chips, accounting for a total of 94%. Among them, the chip field, that is, the semiconductor industry, has the most stringent and demanding requirements for the target material. Copper, aluminum, molybdenum and ITO targets are the most common and widely used targets.
- Categories:News
- Author:
- Origin:
- Time of issue:2023-03-09 10:32
- Views:0
Before understanding Ru sputtering target Wholesale Price, let's first understand the main application fields and technical requirements of sputtering targets.
High-purity sputtering targets are concentrated in the four fields of flat panel display, information storage, solar cells, and chips, accounting for a total of 94%. Among them, the chip field, that is, the semiconductor industry, has the most stringent and demanding requirements for the target material. Copper, aluminum, molybdenum and ITO targets are the most common and widely used targets.
Chip field
"Chip" is the top application field of the target, and it is mainly used in the two links of "wafer manufacturing" and "chip packaging". Coating of solder wires. Chip target is the key raw material for manufacturing integrated circuits, and it is also the target with the highest technical requirements. It needs to ensure ultra-high purity, high-precision size and high integration, so the materials selected are mostly high-purity copper, high-purity aluminum, and high-purity titanium. , high-purity tantalum, high-purity tungsten, copper-manganese alloy, etc., and integrated circuit chips usually require the target purity to be above 5N5, and the dielectric layer, conductor layer, and protective layer should also be sputtered with targets with a purity above 5N. Processes require higher purity metals.
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