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Reasons for 3D printing of spherical tungsten powder
- Categories:Spherical powder news
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- Time of issue:2022-10-13 15:08
- Views:0
(Summary description)Powder metallurgy is a process technology that uses metal powder as a raw material, after forming and sintering, to manufacture products of various shapes.
Reasons for 3D printing of spherical tungsten powder
(Summary description)Powder metallurgy is a process technology that uses metal powder as a raw material, after forming and sintering, to manufacture products of various shapes.
- Categories:Spherical powder news
- Author:
- Origin:
- Time of issue:2022-10-13 15:08
- Views:0
Powder metallurgy is a process technology that uses metal powder as a raw material, after forming and sintering, to manufacture products of various shapes. The advantages are: 1) Special materials can be processed; 2) High material utilization rate; 3) Mass production is possible; 4) High accuracy of material distribution. The disadvantages are: 1) The product has poor strength and toughness; 2) It cannot be made into large-scale products; 3) Only some parts with simple structures can be prepared; 4) The cost of compression molding is high.
3D printing technology, also known as additive manufacturing, is a technology that produces parts by layer-by-layer printing based on digital model files and using bondable materials such as metal powder. The advantages are: 1) Strong production capacity, mainly reflected in the simple operation and high portability of 3D printers; 2) The ability to manufacture complex parts that cannot be produced by powder metallurgy; 3) Low production costs and short production cycles; 4) Products High precision, and the comprehensive performance is superior to the products produced by powder metallurgy; 5) Green and environmentally friendly, with less by-products in the whole process. The disadvantages are: 1) The performance requirements of the metal powder are high; 2) If the operation is improper, the product will also have micro-cracks.
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(1) According to the chemical composition and material of the target, the sputtering target can be divided into metal/non-metal single substance target, alloy target, ceramic/compound target, etc.

High-purity sputtering targets are concentrated in the four fields of flat panel display, information storage, solar cells, and chips, accounting for a total of 94%. Among them, the chip field, that is, the semiconductor industry, has the most stringent and demanding requirements for the target material. Copper, aluminum, molybdenum and ITO targets are the most common and widely used targets.






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