The Os sputtering target is mainly composed of target blank, back plate and other parts. The target blank belongs to the target material bombarded by high-speed ion beams and is the core part. During the process of sputtering coating, after the target blank is hit by ions, the surface atoms It is scattered by sputtering and deposited on the substrate to form an electronic thin film. Due to the low strength of high-purity metal, the sputtering target needs to be installed in a special machine to complete the sputtering process. The inside of the machine is a high-voltage and high-vacuum environment, so the sputtering target blank of ultra-high-purity metal needs to be matched with the back. The plates are joined by different welding processes, and the back plate mainly plays the role of fixing the sputtering target, as well as good electrical and thermal conductivity.

According to the development of high-density and large-capacity hard disks in storage technology, a large number of giant magnetoresistive thin film materials are needed. Generally, the related thin film products prepared by using Os sputtering targets in the information storage industry include hard disks, magnetic head optical disks, etc.
Of course, the uses of Os sputtering targets are not limited to these, and can also be used in industries such as high temperature corrosion resistance, wear-resistant materials, and decorative products. Various types of sputtering thin film materials prepared by sputtering targets are used in semiconductor integrated circuits, Solar photovoltaics, recording media, flat-panel displays, and workpiece surface coatings have been widely used.