A sputtering target is a material for making thin films by sputter deposition or thin film deposition techniques. During this process, the sputtering target material starts out as a solid and is broken down by gas ions into tiny particles that form a spray and coat another material, the so-called substrate. Sputter deposition is commonly used to make semiconductors and computer chips. Therefore, most sputtering target materials are metallic elements or alloys, although there are also ceramic targets that can produce hardened thin coatings for various tools.

Sputtering targets are available in a variety of different materials (alloys, ceramics, metals, etc.) to meet the various needs of thin film process engineers. We offer a range of high-quality ingredients to meet these needs, including:
Tantalum (Ta): Our Electron Beam Melting (EBM) tantalum is inherently high purity and has reliable performance in a wide variety of high vacuum environments.
Molybdenum (Mo): Mo sputtering targets have excellent corrosion resistance and excellent etch characteristics to improve touch screen panel (TSP) reliability.
Niobium (NB): The NB standard is also suitable for TSP applications, especially barrier layers, cover layers and conductive layers in display devices.