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弥散铜
弥散铜2
弥散铜
弥散铜2
Diffuse copper
Compared with oxygen-free copper materials, dispersed copper has higher hardness (HV>125) and higher strength (tensile strength>350MPa), while the corresponding data of oxygen-free copper is HV40,250MPa. And has a higher softening temperature.
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Product description

Compared with oxygen-free copper materials, dispersed copper has higher hardness (HV>125) and higher strength (tensile strength>350MPa), while the corresponding data of oxygen-free copper is HV40,250MPa. And has a higher softening temperature.

Product Features

 

Brand

Melting point

Softening temperature

Density g/cm3

Thermal expansion coefficient (10-6/K) Thermal conductivity W/(M.K)

C15715

1083 ℃

800 ℃

8.84

365

17.6

C1560

1083 ℃

910 ℃

8.81

322

17.6

 

Comparison of the composition and physical properties of various types of dispersed copper and oxygen-free copper (at room temperature, unless otherwise specified).

UNS

Number of alloys

Alumina content

Melting point

Density g/cm3
lb/in3

Electrical conductivity

Thermal conductivity W/(M.K)

Thermal expansion coefficient
(range 20-150℃,
68-300 oF)

Elastic modulus

OFC

0 %

1,083℃
(1,981 oF)

8.94
(0.323)

58 Meg S/m
(101 % IACS)

391 wat/m/OK
(226 BTU/ft/hr/OF)

17.7 μm/m/℃
(9.8 μ-in/in/OF)

115GPa
(17 Mpsi)

UNS-
C15715

0.3 wt. %

1,083℃
(1,981 oF)

8.90
(0.321)

54 Meg S/m
(92 % IACS)

365 wat/m/OK
(211 BTU/ft/hr/OF)

16.6μm/m/℃
(9.2 μ-in/in/OF)

130GPa
(19 Mpsi)

UNS-
C15760

1.1 wt. %

1,083℃
(1,981 oF)

8.81
(0.318)

45Meg S/m
(78 % IACS)

322 wat/m/OK
(186 BTU/ft/hr/OF)

16.6μm/m/℃
(9.2 μ-in/in/OF)

130GPa
(19 Mpsi)

 

If you need to reduce the thermal expansion rate, you can add other materials or elements. Adding them at high room temperature and high-intensity heating will increase the hardness.

Adding Glid AL-60 and 10% niobium to the composite material can improve the strength and conductivity of the material. Its hardness is equivalent to most copper-beryllium and copper-tungsten alloys, and its conductivity is comparable to all RWMA2 levels.

We could not find any corresponding parameters, please add them to the properties table

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欧泰稀材
Copper/molybdenum copper/copper (CPC)
Similar to copper/molybdenum/copper (CMC), copper/molybdenum-copper/copper is also a sandwich structure. It consists of two sub-layers-copper (Cu) and a core layer-molybdenum copper alloy (MoCu), which is in the X area It has a different thermal expansion coefficient from the Y area. Compared with tungsten copper, molybdenum copper and copper/molybdenum/copper materials, copper-molybdenum-copper-copper (Cu/MoCu/Cu) has a higher thermal conductivity and a relatively advantageous price.
Tungsten Copper
1. Tungsten copper electronic packaging materials have adjustable thermal expansion coefficients, which can be matched with different substrates (such as: stainless steel, valve alloy, silicon, gallium arsenide, gallium nitride, aluminum oxide, etc.); <br> 2. No sintering activation elements are added, maintaining good thermal conductivity; <br> 3. Low porosity and good air tightness of the product; <br> 4. Good size control, surface finish and flatness.<br> 5. Provide sheets and molded parts, which can also meet electroplating needs.<br>
Molybdenum copper
Molybdenum copper is a composite material of molybdenum and copper. Its performance is similar to that of tungsten copper, and it also has adjustable thermal expansion coefficient and thermal conductivity. But the density of molybdenum copper is much smaller than that of tungsten copper, so it is more suitable for aerospace and other fields. The product has high purity, uniform structure and excellent performance. Because the Mo-Cu material used does not add any adhesive, the material has high thermal conductivity, and the thermal expansion rate matches the ceramic materials and semiconductor materials in the electronics industry. It saves costs through Mo-Cu stamping and mass production, and machining Good performance. Molybdenum copper material is more resistant to ablation than molybdenum, and has more plasticity and machinability. It can be used as high-temperature parts for rockets and missiles with lower temperatures, and can also replace molybdenum as parts in other weapons. High-power integrated circuits and microwave integrated devices require high electrical and thermal conductivity materials as conductive and heat-dissipating components, while taking into account vacuum performance, heat resistance, and thermal expansion coefficient. The properties of molybdenum copper meet these requirements and are the preferred material in this regard.
Copper-molybdenum-copper (CMC)
Copper-molybdenum-copper (CMC) packaging material is a sandwich-structured flat composite material. It uses pure molybdenum as the core material, and both sides are covered with pure copper or dispersion strengthened copper.  
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