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About target binding

About target binding

  • Categories:News
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  • Time of issue:2021-09-06 18:06
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(Summary description)Recommended target materials for binding: Os sputtering target, Ru sputtering target, rhenium target, Ta sputtering target, Ir sputtering target, ceramic brittle targets and sintered targets; tin, indium and other soft metal targets; targets are too thin, targets Too expensive, etc.

About target binding

(Summary description)Recommended target materials for binding: Os sputtering target, Ru sputtering target, rhenium target, Ta sputtering target, Ir sputtering target, ceramic brittle targets and sintered targets; tin, indium and other soft metal targets; targets are too thin, targets Too expensive, etc.

  • Categories:News
  • Author:
  • Origin:
  • Time of issue:2021-09-06 18:06
  • Views:0
Information

Ultra Minor Metals Ltd. is a special technology enterprise specialized in R & D, manufacturing and operation of minor metals and their alloys, as well as their derivative products. They mainly create exclusive & special minor metals products, and have expanded and formed seven business sectors such as high-purity metal sputtering target for electronic film, refractory metals. So what is target binding? What is the applicable scope and process of target binding? Let's take a look next.

Os sputtering target

Target binding refers to welding the target and the back target with solder. There are three main ways: crimping, brazing and conductive glue.
  1. Crimping: using pressure strips, generally in order to improve the goodness of contact, graphite paper, Pb or In skin will be added;
  2. Brazing: Generally, when using soft solder, the sputtering power is required to be less than 20W/cm2. The solder is usually In, Sn, In-Sn; our company uses indium solder bonding technology.
  3. Conductive adhesive: the conductive adhesive used should be high temperature resistant, and the thickness is 0.02-0.05um
The scope of application of target binding
  Technically speaking, targets with flat surfaces that can be metallized can be bound with copper back targets using our indium welding bonding technology to improve the heat dissipation of the sputtering process and increase the utilization rate of the target.
Recommended target materials for binding: Os sputtering target, Ru sputtering target, rhenium target, Ta sputtering target, Ir sputtering target, ceramic brittle targets and sintered targets; tin, indium and other soft metal targets; targets are too thin, targets Too expensive, etc.
But there are disadvantages to binding in the following situations:
  1. Targets with low melting points, such as indium and selenium, may become soft and deformed when metallized;
  2. For precious metal targets, one is that the actual weight is prone to divergence, and the other is that there will be waste when metalizing and unbinding. It is recommended to pad a piece of copper.
 

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